Gas distribution laminis

Semicorex Gas distribution laminas ludere a discrimine partes in Advanced Pure Plasma Etching Systems, praecipue in semiconductor vestibulum ubi praecisione, uniformitatem, et contaminationem potestate sunt. Nostrum Gas distribution laminam, Engineered ex summus puritate eget vapor depositione Silicon carbide (Cvd sic), quod disposito ad occursum in Stersent postulat of moderni arida etching processibus.

Per Etching processus, reactivum vapores debet introduci in cubiculum in regitur et uniformiter modo ad invigilandum consistent Plasma distribution trans Tafer superficiem. In Gas distribution lamines sunt opportune sita super lagam et serves a dual munus: primo pre-dissipat processus vapores et dirigit eos per seriem ad electrode system. Hoc praecise Gas partus est essentialis ad consequi uniformis Plasma characteres et consistent etch rates per totum laganum.

Etching uniformitatem potest esse ulterius per optimizing iniectio modum reactivum Gas:

• Aluminium etching camera: Reactive Gas solet traditum per shower sita super laganum.

• Silicon Etching camera: initio, in Gas erat infusum a peripheria de lagae, et tunc paulatim evolved ad infusum a super centro lagae ut amplio etching uniformitatem.

Gas distribution laminis, etiam notum ut showerheadheads, sunt a Gas distribution fabrica late in semiconductor artificio processus. Est maxime ad aequaliter distribute Gas in reactionem cubiculum ut semiconductor materiae potest esse aequaliter contingi cum Gas in reactionem processus, improvidus productio efficientiam et uber qualitas. Product est in altum praecisione, princeps munditiae, et multiplex, compositum superficiem curatio (ut sandblasting / anodizing / penicillo nickel plating / electrolytic politionem, etc.). Gas distribution lamines sunt sita in reactionem cubiculum et providere uniformiter deposita Gas film accumsan pro lagestre reactionem amet. Est Core component of laganum productionem.

Per laganum reactionem processus, superficies Gas distribution laminis est dense operuit micropuntur (aperturae 0.2-6 mm). Per pressius disposito porum structuram et Gas iter specialis processus Gas indiget per milia parva foramina in uniformis Gas laminam et aequaliter deposita in lagoenarum. In film stratis in diversis areas de laganum opus ad invigilandum princeps uniformitatem et constantia. Igitur praeter maxime excelsum requisitis mundities et corrosio resistentia, Gas distribution laminis stricte requisita in crassitudinem in stertuum parva foramina in uniformis Gas laminam et burgum interiorem parva foramina. Si turpis mole tolerantia et consistency vexillum deviationis sunt magna vel burgant in aliquo interiore muro crassitudo deposita amet accumsan repugnat, quae directe afficiunt apparatu processus cedat. In plasma-assisted processes (such as PECVD and dry etching), the shower head, as part of the electrode, generates a uniform electric field through an RF power supply to promote uniform distribution of plasma, thereby improving the uniformity of etching or deposition.

NostraCvd sicGas distribution laminis sunt idoneam ad amplis plasma Etching Platforms in semiconductor fabricatione, mems dispensando, et provectus packaging. Custom Cogitationes potest developed ad occursum propria instrumentum requisitis, inter dimensiones, foraminis exempla, et superficies finiatur.

Semicorex Gas distribution laminis ex CVD sic est vitalis component in modern plasma Etching systems, offering eximia Gas partum perficientur, outstanding material diuturnitatem et minimal contaminationem periculo. Usus directe confert ad altiorem processum cedit, inferioris deficit, et iam tool uptime, faciens eam confidebat electionis pro ducens-ora semiconductor vestibulum.