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Silicon Carbide Ceramic Wafer Boat
  • Silicon Carbide Ceramic Wafer BoatSilicon Carbide Ceramic Wafer Boat
  • Silicon Carbide Ceramic Wafer BoatSilicon Carbide Ceramic Wafer Boat
  • Silicon Carbide Ceramic Wafer BoatSilicon Carbide Ceramic Wafer Boat
  • Silicon Carbide Ceramic Wafer BoatSilicon Carbide Ceramic Wafer Boat
  • Silicon Carbide Ceramic Wafer BoatSilicon Carbide Ceramic Wafer Boat

Silicon Carbide Ceramic Wafer Boat

Semicorex laganum scaphas praebet, bases et laganum morem portantium utriusque verticalis / columnae et figurarum horizontalium. Fabrica et elit carbidi pii per multos annos cinematographico cinematographico fuimus. Nostra navis carbida ceramica laganum silicum bonum pretium commodum habet et maxime mercatus Europae et Americanus operit. Expectamus ad longum tempus socium in Sinis fieri.

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Semicorex pii carbide laganum ceramicum navi, ultima solutio lagani pertractatio et tutela in fabricandis semiconductoribus.
Nostra carbida lagana lagana Pii carbida facta est ex materia qualitate alta iacu carbide pii (SiC) adhibita methodo CVD, quae bonam repugnantiam habent ad corrosionem et optimam resistentiam calidis et calidis inpulsae. Ceramici provectus optimum scelerisque resistentiam et plasma durabilitatem liberant dum particulas mitigantes et contaminantes pro lagano portantium capacitatis summus.


Phasellus laoreet condimentum tellus, laoreet condimentum

Technical Properties

Index

Unitas

Precium

Materia Nomen

Silicon Carbide reactionem Sintered

Silicon Carbide

Silicon Carbide recrystallized

Compositio

RBSiC

SSiC

R-SiC

Mole densitas

g/cm3

3

3.15 ± 0.03

2.60-2.70

Flexurae Fortitudo

MPa (kpsi)

338(49).

380(55) ;

80-90 (20°C) 90-100(1400°C)

Compressive fortitudo

MPa (kpsi)

1120 (158)

3970 (560)

> 600

duritia

Button

2700

2800

/

Fractio Tenacity

MPa m1/2

4.5

4

/

Scelerisque Conductivity

W/m.k

95

120

23

Coefficiens Scelerisque Expansion

10-6.1/°C

5

4

4.7

Imprimis Caloris

Joule/g 0k

0.8

0.67

/

Max temperatus in aere

1200

1500

1600

Modulus elasticus

Gpa

360

410

240


Discrimen inter SSiC et RBSiC;

1. Processus Sintering differt. RBSiC est liberum Si in carbidam Pii in temperatura infiltrare, SSiC reformatione naturali in 2100 graduum formatur.

2. SSiC superficiem leviorem, densitatem altiorem et vires superiores habent, ob signationes aliquas strictiores superficiei requisitas, SSiC melius erit.

3. Diversus usus temporis sub diversis PH et temperatus, SSiC est longior quam RBSiC


Features of Silicon Carbide Ceramic Wafer cymba

Superior calor resistentia & scelerisque uniformitatem
SiC crystal obductis ad superficiem levem
Princeps firmitatem contra chemica purgatio
Materia designata est ut rimas et delaminationes non fiant.



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