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IV Inch High Puritas Semi-Insulating HPSI SiC Duplex latus politum laganum Substratum
  • IV Inch High Puritas Semi-Insulating HPSI SiC Duplex latus politum laganum SubstratumIV Inch High Puritas Semi-Insulating HPSI SiC Duplex latus politum laganum Substratum
  • IV Inch High Puritas Semi-Insulating HPSI SiC Duplex latus politum laganum SubstratumIV Inch High Puritas Semi-Insulating HPSI SiC Duplex latus politum laganum Substratum

IV Inch High Puritas Semi-Insulating HPSI SiC Duplex latus politum laganum Substratum

Semicorex varias praebet unctas 4H et 6H SiC. Fabrica et lagana subiecta multos annos fabrica fuimus. Nostra 4 Inch High Purity Semi-Insulating HPSI SiC Duplex latus politum Wafer Substratum bonum pretium commodum habet et maxime mercatus Europae et Americanae obtegunt. Expectamus ad longum tempus socium in Sinis fieri.

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Semicorex integram carbidam silicon (SiC) lagani productam lineam, inclusis 4H et 6H substratam cum N-typo, P-type et lagana semi-insulating alta puritatis, possunt esse cum vel sine epitaxy.

Introducendo nostram aciem sectionis 4 Inch High Purity Semi-Insulating HPSI SiC Duplex latus politum Wafer Substratum, top-of-linea producto destinatum ad postulandas postulationes electronicarum et semiconductorium applicationum provectorum.

4 Inch High Purity Semi-Insulating HPSI SiC Duplex latus politum Wafer Substratum maxime adhibetur in communicationibus 5G, systematibus radar, ductu capitis, satellitibus communicationibus, warplanis et aliis agris, commoda amplificandi RF range, ultra longi temporis intervallum. identificatio, anti-jamming et summus celeritas, summus capacitas informationum translationis et aliarum applicationum, consideratur maxime idealis subiectum pro Proin potentiae cogitationibus faciendis.


Formularium:

Diameter: 4″

Geminus-politus

l Grade: Productio, Investigatio, Donec

4H-SiC HPSI Wafer

● Crassitudo: 500±25 μm

●l Micropipe densitas: ≤1 ea/cm2~ ≤10 ea/cm2


Items

Productio

Inquisitionis

phantasma

Crystal Parameters

Polytypus

4H

Superficiem directio in-axis

<0001>

Superficiem orientationis off-axis

0±0.2°

(0004) FWHM

≤45arcsec

≤60arcsec

≤1OOarcsec

Electrical Parameters

Type

HPSI

Resistentia

≥1 E9ohm·cm

% area > 1 E5ohm·cm

70% area > 1 E5ohm·cm

Mechanica Parameters

Diameter

99.5 - 100mm

Crassitudo

500±25 μm

Prima plana propensionis

[1-100]±5°

Prima plana longitudo

32.5±1.5mm

Secundarium plana positione

90° CW a primo plano ± 5°. Pii faciem sursum

Secundarium planae longitudinis

18±1.5mm

TTV

≤5 μm

≤10 μm

≤20 μm

LTV

≤2 μm(5mm*5mm)

≤5 μm(5mm*5mm)

QUOD'

Arcum

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤20 μm

≤45 μm

≤50 μm

Frons (Si-face) asperitas (AFM)

Ra≤0.2nm (5μm*5μm)

Structure

Micropipe density

≤1 ea/cm2

≤5 ea/cm2

≤10 ea/cm2

Inclusio density carbonis

≤1 ea/cm2

QUOD'

Hexagonal inanis

Nullus

QUOD'

Metallum immunditiae

≤5E12atoms/cm2

QUOD'

Ante Quality

Front

And

Superficiem metam

Si-face CMP

Particulas

≤60ea/laganum (size≥0.3μm)

QUOD'

Exasperat

≤2ea/mm. Cumulativo longitudo ≤Diameter

Cumulative length≤2*Diameter

QUOD'

Orange cortices / foveas / maculas / striations / rimas / contagione

Nullus

QUOD'

Ora eu / indents / fractura / hex p

Nullus

Polytypus areis

Nullus

Cumulativo area≤20%

Cumulativo area≤30%

Ante laser vestigium

Nullus

Back Quality

Retro metam

C-faciem CMP

Exasperat

≤5ea/mm,Cumulative length≤2*Diameter

QUOD'

Retro defectus (ore eu / indents)

Nullus

Retro asperitatem

Ra≤0.2nm (5μm*5μm)

Back laser notati

I mm (a summo ore)

Ore

Ore

Chamfer

Packaging

Packaging

Sacculus interior nitrogeni repletus est, et sacculus exterior vacuumedtur.

laganum multi-reta epi-parata.

*Nota "NA" nullum significat petitionem Items not mentioned may refer to SEMI-STD.




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