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VI Inch Semi-Insulating HPSI SiC Wafer
  • VI Inch Semi-Insulating HPSI SiC WaferVI Inch Semi-Insulating HPSI SiC Wafer
  • VI Inch Semi-Insulating HPSI SiC WaferVI Inch Semi-Insulating HPSI SiC Wafer

VI Inch Semi-Insulating HPSI SiC Wafer

Semicorex varias praebet unctas 4H et 6H SiC. Fabrica et elit carbidi Pii per multos annos fuimus. Nostra duplex expolitur 6 Inch Semi-Insulating HPSI SiC Wafer bonum pretium commodum habet ac plurimas mercatus Europae et Americanae tegunt. Expectamus ad longum tempus socium in Sinis fieri.

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depictio producti

Semicorex integram carbidam silicon (SiC) lagani productam lineam, inclusis 4H et 6H substratam cum N-typo, P-type et lagana semi-insulating alta puritatis, possunt esse cum vel sine epitaxy.

Diameter 6 unciae nostrae 6 Inch Semi-Insulating HPSI SiC Wafer magnam aream superficiei praebet ad fabricandas potentias electronicas cogitationes sicut MOSFETs, Schottky Diodes, et alia applicationes altae intentionis. 6 Inch Semi-Insulating HPSI SiC Wafer maxime adhibitum est in 5G communicationibus, systematibus radar, ductu capitis, satellitibus communicationibus, warplanis et aliis campis, cum emolumentis identitatis RF amplificandi, identitatis ultra-longae, anti-jamming et altae. -speed, summus capacitas informationum applicationum transferendi, consideratur maxime idealis subiecta ad fabricandas proin potentias machinas.


Formularium:

Diameter: 6″

-Duplex-politus

Gradus: Productio, Research, Dummy

4H-SiC HPSI Wafer

● Crassitudo: 500±25 μm

● Micropipe densitas: ≤1 ea/cm2~ ≤15 ea/cm2


Items

Productio

Inquisitionis

phantasma

Crystal Parameters

Polytypus

4H

Superficiem directio in-axis

<0001>

Superficiem orientationis off-axis

0±0.2°

(0004) FWHM

≤45arcsec

≤60arcsec

≤1OOarcsec

Electrical Parameters

Type

HPSI

Resistentia

≥1 E8ohm·cm

% area > 1 E5ohm·cm

70% area > 1 E5ohm·cm

Mechanica Parameters

Diameter

150±0.2 mm

Crassitudo

500±25 μm

Prima plana propensionis

[1-100] ± 5° vel Notch

Prima longitudo plana / profundum

47.5± 1.5mm vel 1 - 1.25mm

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Arcum

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

Frons (Si-face) asperitas (AFM)

Ra≤0.2nm (5μm*5μm)

Structure

Micropipe density

≤1 ea/cm2

≤10 ea/cm2

≤15 ea/cm2

Inclusio density carbonis

≤1 ea/cm2

QUOD'

Hexagonal inanis

Nullus

QUOD'

Metallum immunditiae

≤5E12atoms/cm2

QUOD'

Ante Quality

Front

And

Superficiem metam

Si-face CMP

Particulas

≤60ea/laganum (size≥0.3μm)

QUOD'

Exasperat

≤5ea/mm. Cumulativo longitudo ≤Diameter

Cumulativus length≤300mm

QUOD'

Orange cortices / foveas / maculas / striations / rimas / contagione

Nullus

QUOD'

Ora eu / indents / fractura / hex p

Nullus

Polytypus areis

Nullus

Cumulativo area≤20%

Cumulativo area≤30%

Ante laser vestigium

Nullus

Back Quality

Retro metam

C-faciem CMP

Exasperat

≤5ea/mm,Cumulative length≤2*Diameter

QUOD'

Retro defectus (ore eu / indents)

Nullus

Retro asperitatem

Ra≤0.2nm (5μm*5μm)

Back laser notati

"SEMI"

Ore

Ore

Chamfer

Packaging

Packaging

Epi-paratum in vacuo packaging

Multi laganum cassette packaging

*Nota "NA" nullum significat petitionem Items not mentioned may refer to SEMI-STD.




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